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 High Voltage Power MOSFETs
N-Channel Enhancement Mode Avalanche Rated, High dv/dt
IXTA 3N120 IXTP 3N120
VDSS 1200 V
ID25 3A
RDS(on) 4.5
Symbol VDSS VDGR VGS VGSM ID25 IDM IAR EAR EAS dv/dt PD TJ TJM Tstg TL Md Weight
Test Conditions TJ = 25C to 150C TJ = 25C to 150C; RGS = 1 M Continuous Transient TC = 25C TC = 25C, pulse width limited by TJM TC = 25C TC = 25C
Maximum Ratings 1200 1200 20 30 3 12 3 20 700 V V V V A A A mJ mJ V/ns W C C C C Features International standard packages Low RDS (on) Rated for unclamped Inductive load Switching (UIS) Molding epoxies meet UL 94 V-0 flammability classification Advantages Easy to mount Space savings High power density G = Gate S = Source D = Drain TAB = Drain
G S D (TAB)
G DS
TO-220 (IXTP)
D (TAB)
TO-263 (IXTA)
IS IDM, di/dt 100 A/s, VDD VDSS, TJ 150C, RG = 2 TC = 25C
5 200 -55 to +150 150 -55 to +150
1.6 mm (0.063 in) from case for 10 s Mounting torque (TO-220) TO-220 TO-263
300
1.13/10 Nm/lb.in. 4 2 g g
Symbol
Test Conditions
Characteristic Values (TJ = 25C, unless otherwise specified) min. typ. max. 1200 2.0 5.0 100 TJ = 25C TJ = 125C 25 1 4.5 V V nA A mA
VDSS VGS(th) IGSS IDSS RDS(on)
VGS = 0 V, ID = 1 mA VDS = VGS, ID = 250 A VGS = 20 VDC, VDS = 0 VDS = 0.8 VDSS VGS = 0 V VGS = 10 V, ID = 0.5 ID25 Note 1
(c) 2004 IXYS All rights reserved
DS98844E(02/04)
IXTA 3N120 IXTP 3N120
Symbol Test Conditions Characteristic Values (TJ = 25C, unless otherwise specified) min. typ. max. 1.5 2.6 1100 1350 VGS = 0 V, VDS = 25 V, f = 1 MHz 110 135 40 17 VGS = 10 V, VDS = 0.5 * VDSS, ID = 0.5 * ID25 RG = 4.7 (External), 15 32 18 42 VGS = 10 V, VDS = 0.5 * VDSS, ID = 0.5 * ID25 8 21 0.62 (TO-220) 0.25 60 S pF pF pF ns ns ns ns nC nC nC K/W K/W
Pins: 1 - Gate 3 - Source 2 - Drain 4 - Drain Bottom Side
TO-220 (IXTP) Outline
gfs Ciss Coss Crss td(on) tr td(off) tf Qg(on) Qgs Qgd RthJC RthCK
VDS = 20 V; ID = 0.5 * ID25, Note 1
Source-Drain Diode Symbol IS ISM VSD t rr Test Conditions VGS = 0 V
Characteristic Values (TJ = 25C, unless otherwise specified) min. typ. max. 3 12 1.5 700 A A V ns TO-263 (IXTA) Outline
Repetitive; pulse width limited by TJM IF = IS, VGS = 0 V, Note 1 IF = IS, -di/dt = 100 A/s, VR = 100 V
Notes: 1. Pulse test, t 300 s, duty cycle d 2 %
1. 2. 3. 4.
Gate Drain Source Drain Bottom Side
Dim. A A1 b b2 c c2 D D1 E E1 e L L1 L2 L3 L4 R
Millimeter Min. Max. 4.06 2.03 0.51 1.14 0.46 1.14 8.64 7.11 9.65 6.86 2.54 14.61 2.29 1.02 1.27 0 0.46 4.83 2.79 0.99 1.40 0.74 1.40 9.65 8.13 10.29 8.13 BSC 15.88 2.79 1.40 1.78 0.38 0.74
Inches Min. Max. .160 .080 .020 .045 .018 .045 .340 .280 .380 .270 .100 .575 .090 .040 .050 0 .018 .190 .110 .039 .055 .029 .055 .380 .320 .405 .320 BSC .625 .110 .055 .070 .015 .029
IXYS reserves the right to change limits, test conditions, and dimensions.
IXYS MOSFETs and IGBTs are covered by one or more of the following U.S. patents: 4,835,592 4,881,106 5,017,508 5,049,961 5,187,117 5,486,715 6,306,728B1 6,259,123B1 6,306,728B1 4,850,072 4,931,844 5,034,796 5,063,307 5,237,481 5,381,025 6,404,065B1 6,162,665 6,534,343
IXTA 3N120 IXTP 3N120
Fig. 1. Output Characteristics @ 25 Deg. C
3 2.5 VG S = 10V 7V 6V 7 6 7V 5
Fig. 2. Extended Output Characteristics @ 25 deg. C
VG S = 10V
I D - Amperes
I D - Amperes
2 1 .5 1 0.5 0 0 2 4
4 3 2 1 0
6V
5V
5V
V DS - Volts
6
8
1 0
1 2
0
5
1 0
1 5
20
25
30
V DS - Volts
Fig. 3. Output Characteristics @ 125 Deg. C
3 2.5 VG S = 10V 7V 6V
Fig. 4. RDS(on) Normalized to ID25 Value vs. Junction Temperature
2.8 2.5 VG S = 10V
R D S (on) - Normalized
2.2 1 .9 1 .6 1 .3 1 0.7 0.4 I D = 3A I D = 1.5A
I D - Amperes
2 1 .5 5V 1 0.5 0 0 5 1 0 1 5 20 25
-50
-25
0
25
50
75
1 00
1 25
1 50
V DS - Volts
TJ - Degrees Centigrade
Fig. 5. RDS(on) Normalized to ID25 Value vs. ID
2.8 2.5 VG S = 10V T J = 125 C 3.5 3
Fig. 6. Drain Current vs. Case Temperature
R D S (on) - Normalized
I D - Amperes
2.2 1 .9 1 .6 1 .3 1 0.7 0 1 2 3
2.5 2 1 .5 1 0.5 0
T J = 25 C
4
5
6
7
-50
-25
0
25
50
75
1 00
1 25
1 50
I D - Amperes
TC - Degrees Centigrade
(c) 2004 IXYS All rights reserved
IXTA 3N120 IXTP 3N120
Fig. 7. Input Admittance
6 5 8 7 6 T J = -40 C 25 C 125 C
Fig. 8. Transconductance
4 3 2 1 0 3.5 4 4.5 5 5.5 6 6.5 T J = 120 C 25 C -40 C
g f s - Siemens
I D - Amperes
5 4 3 2 1 0 0
1 .5
3
4.5
6
7.5
9
V GS - Volts
I D - Amperes
Fig. 9. Source Current vs. Source-To-Drain Voltage
9 8 7 8 1 0
Fig. 10. Gate Charge
VD S = 600V I D = 1.5A I G = 10mA
I S - Amperes
VG S - Volts
T J = 25 C
6 5 4 3 2 1 0 0.4 0.5 0.6 0.7 0.8 0.9 T J = 125 C
6
4
2
0 0 8 1 6 24 32 40 48
V SD - Volts
Q G - nanoCoulombs
Fig. 11. Capacitance
1 0000 f = 1M Hz 0.7 0.6 C iss 1 000
Fig. 12. Maximum Transient Thermal Resistance
Capacitance - pF
R (th) J C - (C/W)
25 30 35 40
0.5 0.4 0.3 0.2 0.1 0
C oss 1 00 C rss 1 0 0 5 1 0 1 5
V DS - Volts
20
1
Pulse Width - milliseconds
1 0
1 00
1 000
IXYS reserves the right to change limits, test conditions, and dimensions.
IXYS MOSFETs and IGBTs are covered by one or more of the following U.S. patents: 4,835,592 4,881,106 5,017,508 5,049,961 5,187,117 5,486,715 6,306,728B1 6,259,123B1 6,306,728B1 4,850,072 4,931,844 5,034,796 5,063,307 5,237,481 5,381,025 6,404,065B1 6,162,665 6,534,343


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